Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046543 | Package substrate and chip package structure using the same | Han-Chieh Hsieh, Chao-Min Lai, Nan-Chin Chuang | 2024-07-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046543 | Package substrate and chip package structure using the same | Han-Chieh Hsieh, Chao-Min Lai, Nan-Chin Chuang | 2024-07-23 |