Issued Patents All Time
Showing 25 most recent of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12387999 | Planar integrated circuit package interconnects | Sanka Ganesan | 2025-08-12 |
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Biancun Xie, Jianyong Xie, Sujit Sharan, Debendra Mallik | 2025-06-24 |
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon | 2025-06-24 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik | 2025-05-13 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-04-08 |
| 12261124 | Embedded die architecture and method of making | Sanka Ganesan, Sri Chaitra Jyotsna Chavali | 2025-03-25 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-01-14 |
| 12199085 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2025-01-14 |
| 12148703 | EMIB patch on glass laminate substrate | Robert Alan May | 2024-11-19 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan | 2024-11-12 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-07-23 |
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Jimin Yao +2 more | 2024-06-04 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Sanka Ganesan, Doug B. Ingerly, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon | 2024-05-07 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Rahul N. Manepalli, Gang Duan, Debendra Mallik | 2024-05-07 |
| 11923257 | Hybrid microelectronic substrates | Robert Starkston, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur | 2024-03-05 |
| 11901248 | Embedded die architecture and method of making | Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha | 2024-02-13 |
| 11894359 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley McCullough | 2024-02-06 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-02-06 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2024-01-09 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik | 2024-01-09 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |