Issued Patents All Time
Showing 151–175 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9093411 | Pad structure having contact bars extending into substrate and wafer having the pad structure | Ying-Ju Chen, Hsien-Wei Chen, Hao-Yi Tsai | 2015-07-28 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 9041215 | Single mask package apparatus and method | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2015-05-26 |
| 9021682 | Apparatus for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai +2 more | 2015-05-05 |
| 9013038 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Tsung-Yuan Yu, Hao-Yi Tsai, Chen-Hua Yu | 2015-04-21 |
| 9006891 | Method of making a semiconductor device having a post-passivation interconnect structure | Shih-Wei Liang, Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2015-04-14 |
| 8987915 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chang-Chia Huang, Chih-Wei Lin, Ming-Da Cheng | 2015-03-24 |
| 8981576 | Structure and method for bump to landing trace ratio | Chen-Hua Yu, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu, Yen-Liang Lin | 2015-03-17 |
| 8970001 | Guard ring design for maintaining signal integrity | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2015-03-03 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2015-02-24 |
| 8936730 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Chung-Shi Liu, Chen-Hua Yu +1 more | 2015-01-20 |
| 8916956 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Hao-Yi Tsai, Jui-Pin Hung, Chien-Hsun Lee, Kai-Chiang Wu | 2014-12-23 |
| 8912651 | Package-on-package (PoP) structure including stud bulbs and method | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2014-12-16 |
| 8890274 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee | 2014-11-18 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang +7 more | 2014-11-11 |
| 8823180 | Package on package devices and methods of packaging semiconductor dies | Tsung-Ding Wang, Ming-Chung Sung, Jiun Yi Wu, Chien-Hsiun Lee | 2014-09-02 |
| 8796132 | System and method for forming uniform rigid interconnect structures | Ming-Chung Sung, Yung Ching Chen, Chien-Hsun Lee, Chen-Hua Yu | 2014-08-05 |
| 8759964 | Wafer level package structure and fabrication methods | Han-Ping Pu | 2014-06-24 |
| 8749043 | Package on package structure | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Kai-Chiang Wu | 2014-06-10 |
| 8748306 | Cleaning residual molding compound on solder bumps | Yi-Yang Lei, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu | 2014-06-10 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Yi-Wen Wu, Hsiu-Jen Lin +2 more | 2014-05-27 |
| 8716858 | Bump structure with barrier layer on post-passivation interconnect | Chen-Fa Lu, Chung-Shi Liu, Chen-Hua Yu | 2014-05-06 |
| 8703539 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Hao-Yi Tsai, Jui-Pin Hung, Chien-Hsiun Lee, Kai-Chiang Wu | 2014-04-22 |
| 8685798 | Methods for forming through vias | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Hao-Yi Tsai, Da-Yuan Shih | 2014-04-01 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chung-Ying Yang, Chao-Wen Shih, Hao-Yi Tsai, Hsien-Wei Chen, Tzuan-Horng Liu | 2014-03-11 |