Issued Patents All Time
Showing 126–150 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443812 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Tsung-Yuan Yu, Hao-Yi Tsai, Chen-Hua Yu | 2016-09-13 |
| 9425136 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2016-08-23 |
| 9418978 | Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Chih-Wei Lin | 2016-08-16 |
| 9397137 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee | 2016-07-19 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Yung-Ping Chiang, Shih-Wei Liang, Tsung-Yuan Yu +2 more | 2016-07-19 |
| 9397060 | Package on package structure | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Kai-Chiang Wu | 2016-07-19 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2016-06-07 |
| 9355978 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Hao-Yi Tsai, Chen-Hua Yu | 2016-05-31 |
| 9343433 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Chen-Hua Yu | 2016-05-17 |
| 9337135 | Pop joint through interposer | Chien-Hsun Lee, Yu-Min Liang, Jiun Yi Wu | 2016-05-10 |
| 9331023 | Device packaging | Ming-Kai Liu, Yu-Peng Tsai, Kai-Chiang Wu, Wei-Hung Lin, Hao-Yi Tsai | 2016-05-03 |
| 9324587 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-04-26 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9305890 | Package having substrate with embedded metal trace overlapped by landing pad | Yu-Min Liang, Yu-Feng Chen | 2016-04-05 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng, Hao-Yi Tsai +1 more | 2016-03-15 |
| 9275925 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu, Tsung-Yuan Yu | 2016-03-01 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-02-16 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Tsung-Ding Wang, Chien-Hsiun Lee, Hao-Yi Tsai, Chen-Hua Yu | 2016-01-19 |
| 9219106 | Integrated inductor | Yen-Liang Lin, Chen-Shien Chen, Ching-Wen Hsiao, Tsung-Ding Wang | 2015-12-22 |
| 9219030 | Package on package structures and methods for forming the same | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng | 2015-12-22 |
| 9171790 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee, Jiun Yi Wu, Ming-Da Cheng | 2015-10-27 |
| 9165875 | Low profile interposer with stud structure | Chen-Hua Yu, Hao-Yi Tsai, Kai-Chiang Wu | 2015-10-20 |
| 9123601 | Package on package structure | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Kai-Chiang Wu | 2015-09-01 |
| 9123763 | Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Chih-Wei Lin | 2015-09-01 |