Issued Patents All Time
Showing 76–100 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2019-01-08 |
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-12-25 |
| 10163842 | Semiconductor structure and manufacturing method thereof | Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Hon-Lin Huang, Sheng-Yu Wu +1 more | 2018-12-25 |
| 10157893 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2018-12-18 |
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-12-11 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai +2 more | 2018-12-04 |
| 10121749 | Method of fabricating a post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu | 2018-11-06 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee | 2018-10-02 |
| 10062659 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2018-08-28 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2018-08-21 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chen-Hua Yu | 2018-08-21 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2018-08-14 |
| 10043770 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu, Tsung-Yuan Yu | 2018-08-07 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng, Ming-Che Liu +2 more | 2018-07-17 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chien-Hsun Lee, Chen-Hua Yu, Jiun Yi Wu, Ming-Da Cheng | 2018-07-10 |
| 9984999 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Dean Wang, Chen-Hua Yu | 2018-05-29 |
| 9935081 | Hybrid interconnect for chip stacking | Kuo Lung Pan, Yu-Feng Chen, Chen-Shien Chen | 2018-04-03 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2018-04-03 |
| 9935047 | Bonding structures and methods forming the same | Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2018-04-03 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Hung-Jen Lin, Jiun Yi Wu, Chien-Hsun Lee | 2018-04-03 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-03-13 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2018-01-16 |
| 9831140 | Wafer having pad structure | Ying-Ju Chen, Hsien-Wei Chen, Hao-Yi Tsai | 2017-11-28 |