Issued Patents All Time
Showing 51–75 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2021-08-24 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang +1 more | 2021-06-01 |
| 11018065 | Semiconductor device structure with magnetic element in testing region | Mill-Jer Wang, Tang-Jung Chiu, Chi-Chang Lai, Chia-Heng Tsai, Weii LIAO | 2021-05-25 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2021-05-11 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Kuo-Ching Hsu | 2021-04-20 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Ming-Da Cheng | 2021-02-02 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2020-12-08 |
| 10825798 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Chen-Hua Yu | 2020-11-03 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chen-Hua Yu | 2020-07-14 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10700001 | Forming bonding structures by using template layer as templates | Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2020-06-30 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Chen-Shien Chen | 2020-05-05 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |
| 10522481 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu | 2019-12-31 |
| 10510731 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-12-17 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2019-08-20 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2019-07-16 |
| 10319695 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2019-06-11 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Yung-Ping Chiang, Chao-Wen Shih, Hao-Yi Tsai | 2019-06-11 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu, Tsung-Yuan Yu | 2019-06-04 |
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Kuo-Ching Hsu | 2019-04-30 |