Issued Patents All Time
Showing 101–125 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812427 | Package on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2017-11-07 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Chen-Hua Yu, Chien-Hsiun Lee, Yung Ching Chen, Jiun Yi Wu | 2017-09-19 |
| 9768090 | Substrate design for semiconductor packages and method of forming same | Yu-Min Liang, Jiun Yi Wu | 2017-09-19 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-08-08 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2017-07-18 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng +2 more | 2017-05-30 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2017-05-16 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2017-05-16 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2017-05-09 |
| 9646943 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2017-05-09 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Wei Sen Chang, Yu-Feng Chen, Chen-Shien Chen | 2017-05-02 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2017-04-25 |
| 9633963 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Hao-Yi Tsai, Chen-Hua Yu | 2017-04-25 |
| 9633870 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu, Tsung-Yuan Yu | 2017-04-25 |
| 9613914 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu | 2017-04-04 |
| 9559076 | Package having substrate with embedded metal trace overlapped by landing pad | Yu-Min Liang, Yu-Feng Chen | 2017-01-31 |
| 9543259 | Semiconductor structure with oval shaped conductor | Yung-Ping Chiang, Chao-Wen Shih, Hao-Yi Tsai | 2017-01-10 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Chen-Hua Yu, Chen-Shien Chen, Yu-Jen Tseng | 2017-01-03 |
| 9536818 | Semiconductor package and method of forming the same | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2017-01-03 |
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-12-27 |
| 9530757 | Single mask package apparatus | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2016-12-27 |
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu +1 more | 2016-11-22 |
| 9502394 | Package on-Package (PoP) structure including stud bulbs and method | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2016-11-22 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Chang-Pin Huang, Hsien-Ming Tu, Hao-Yi Tsai, Shih-Wei Liang +1 more | 2016-10-04 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Sheng-Yu Wu, Ching-Wen Hsiao, Tin-Hao Kuo, Chen-Shien Chen +2 more | 2016-09-20 |