Issued Patents All Time
Showing 201–215 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7656042 | Stratified underfill in an IC package | Szu-Wei Lu, Tjandra Winata Karta, Chien-Hsiun Lee | 2010-02-02 |
| 7642631 | Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer | Szu-Wei Lu, Hsin-Hui Lee, Ming-Chung Sung | 2010-01-05 |
| 7588963 | Method of forming overhang support for a stacked semiconductor device | Te-Tsung Chao, Chung-Yi Lin, Abel Chang | 2009-09-15 |
| 7573138 | Stress decoupling structures for flip-chip assembly | Chien-Hsiun Lee | 2009-08-11 |
| 7491624 | Method of manufacturing low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Hsin-Hui Lee, Chien-Hsiun Lee | 2009-02-17 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads | Szu-Wei Lu, Hsin-Hui Lee, Chung Yu Wang | 2008-04-22 |
| 7265034 | Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade | Szu-Wei Lu, Hsin-Hui Lee, Ming-Chung Sung | 2007-09-04 |
| 7170159 | Low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Hsin-Hui Lee, Chien-Hsiun Lee | 2007-01-30 |
| 7116002 | Overhang support for a stacked semiconductor device, and method of forming thereof | Te-Tsung Chao, Chung-Yi Lin, Abel Chang | 2006-10-03 |
| 6600233 | Integrated circuit package with surface mounted pins on an organic substrate | Hwai-Peng Yeoh, Hamid Azimi, Amir Nur Rashid Wagiman | 2003-07-29 |
| 6413849 | Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor | Hwai-Peng Yeoh, Hamid Azimi, Amir Wagiman | 2002-07-02 |
| 6191475 | Substrate for reducing electromagnetic interference and enclosure | Harry G. Skinner, Neil C. Delaplane, Ravi Mahajan, Robert Starkston, Ron Edsall | 2001-02-20 |
| 6163065 | Energy-absorbing stable guard ring | Krishna Seshan | 2000-12-19 |
| 5936838 | MPC module with exposed C4 die and removal thermal plate design | Gregory Turturro, Chia-Pin Chiu | 1999-08-10 |
| 5936304 | C4 package die backside coating | George F. Raiser, Ravi Mahajan, Brad Menzies | 1999-08-10 |