Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7588963 | Method of forming overhang support for a stacked semiconductor device | Mirng-Ji Lii, Chung-Yi Lin, Abel Chang | 2009-09-15 |
| 7116002 | Overhang support for a stacked semiconductor device, and method of forming thereof | Mirng-Ji Lii, Chung-Yi Lin, Abel Chang | 2006-10-03 |
| 6849523 | Process for separating dies on a wafer | Shu-Shen Chiu | 2005-02-01 |
| 6468813 | Method of automatically identifying and skipping defective work pieces for wire-bonding operation | Hui Fang | 2002-10-22 |
| 6405357 | Method for positioning bond pads in a semiconductor die | Hui Fang | 2002-06-11 |
| 6391759 | Bonding method which prevents wire sweep and the wire structure thereof | Hui Fang | 2002-05-21 |
| 6291898 | Ball grid array package | Yung-I Yeh, Ya Ping Hung, Hui Fang | 2001-09-18 |