Issued Patents All Time
Showing 726–750 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867982 | Hybrid integrated circuit package and method | Jiun Yi Wu, Hsing-Kuo Hsia | 2020-12-15 |
| 10867958 | Integrated circuit with a thermally conductive underfill | Tien-I Bao | 2020-12-15 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2020-12-15 |
| 10867941 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2020-12-15 |
| 10867938 | Package structure | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang | 2020-12-15 |
| 10867947 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Yu-Min Liang | 2020-12-15 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867884 | Heat spreading device and method | Wensen Hung, Ming-Fa Chen, Tsung-Yu Chen | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan | 2020-12-15 |
| 10867885 | Heat spreading device and method | Wensen Hung, Ming-Fa Chen, Tsung-Yu Chen | 2020-12-15 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10867832 | Apparatus for holding semiconductor wafers | Chien Ling Hwang | 2020-12-15 |
| 10867874 | Semiconductor device and method | Hui-Jung Tsai, Yun Chen Hsieh, Hung-Jui Kuo | 2020-12-15 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10866373 | Optical transceiver and manufacturing method thereof | Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867911 | InFO coil structure and methods of manufacturing same | Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2020-12-15 |
| 10867936 | Semiconductor device with shield for electromagnetic interference | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen | 2020-12-15 |
| 10861809 | Semiconductor structure and method of forming | Yu-Hsiang Hu, Hung-Jui Kuo | 2020-12-08 |
| 10861814 | Integrated fan-out packages and methods of forming the same | Tzung-Hui Lee, Chi-Ming Tsai, Hung-Jui Kuo, Ming-Che Ho | 2020-12-08 |
| 10861773 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2020-12-08 |
| 10861835 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |