Issued Patents All Time
Showing 751–775 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861773 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2020-12-08 |
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung | 2020-12-01 |
| 10853616 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-01 |
| 10854552 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2020-12-01 |
| 10854568 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2020-12-01 |
| 10854577 | 3D die stacking structure with fine pitches | Chen-Shien Chen, Shou-Cheng Hu | 2020-12-01 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2020-11-24 |
| 10847493 | Bump-on-trace interconnect | Chen-Shien Chen | 2020-11-24 |
| 10847459 | Semiconductor die contact structure and method | Chung-Shi Liu | 2020-11-24 |
| 10847414 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2020-11-24 |
| 10847304 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2020-11-24 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10840218 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2020-11-17 |
| 10840217 | Stacked chip package and methods of manufacture thereof | Ming-Fa Chen, Sung-Feng Yeh | 2020-11-17 |
| 10833039 | Multi-chip fan out package and methods of forming the same | Jing-Cheng Lin, Jui-Pin Hung | 2020-11-10 |
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |
| 10825798 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii | 2020-11-03 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2020-11-03 |
| 10825696 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2020-11-03 |
| 10825693 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Shih-Ting Lin | 2020-11-03 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10818640 | Die stacks and methods forming same | Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-27 |
| 10818607 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2020-10-27 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-20 |