Issued Patents All Time
Showing 701–725 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937743 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu | 2021-03-02 |
| 10937736 | Hybrid integrated circuit package and method | Jiun Yi Wu, Hsing-Kuo Hsia | 2021-03-02 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |
| 10937721 | Semiconductor structure | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2021-03-02 |
| 10937718 | Package structures and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2021-03-02 |
| 10930633 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |
| 10930628 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2021-02-23 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2021-02-16 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Ju-Ming Huang, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao | 2021-02-16 |
| 10916529 | Electronics card including multi-chip module | Chien-Hsun Lee, Jiun Yi Wu | 2021-02-09 |
| 10914895 | Package structure and manufacturing method thereof | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2021-01-05 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai | 2021-01-05 |
| 10878073 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-12-29 |
| 10879153 | Chip package structure | Kuo-Chung Yee, Chun-Hui Yu | 2020-12-29 |
| 10879183 | Semiconductor device and method of manufacture | Chuei-Tang Wang, Chung-Hao Tsai | 2020-12-29 |
| 10879220 | Package-on-package structure and manufacturing method thereof | Kuo-Chung Yee, Chun-Hui Yu | 2020-12-29 |
| 10872874 | Bonding apparatus and method of bonding substrates | Ebin Liao, Wen-Chih Chiou | 2020-12-22 |
| 10872878 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Chuei-Tang Wang, Monsen Liu | 2020-12-22 |
| 10872865 | Electric magnetic shielding structure in packages | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2020-12-22 |
| 10872836 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2020-12-22 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10867874 | Semiconductor device and method | Hui-Jung Tsai, Yun Chen Hsieh, Hung-Jui Kuo | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan | 2020-12-15 |