Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643544 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Guan-Syun Tseng | 2023-05-09 |
| 11414532 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same | Chih-Wei Liao, Guan-Syun Tseng, Tsung-Hsien Lin | 2022-08-16 |
| 11339258 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Guan-Syun Tseng, Tsung-Hsien Lin, Chen-Hua Yu | 2022-05-24 |
| 11001759 | Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Chang-Chien Yang, Tsung-Hsien Lin | 2021-05-11 |
| 10994516 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Hsien-Te Chen, Tsung-Hsien Lin | 2021-05-04 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao | 2021-02-16 |
| 10563006 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Guan-Syun Tseng, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao | 2020-02-18 |