Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11001759 | Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Tsung-Hsien Lin, Ju-Ming Huang | 2021-05-11 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Ju-Ming Huang, Chen-Hua Yu, Guan-Syun Tseng, Chih-Wei Liao | 2021-02-16 |
| 10563006 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chih-Wei Liao | 2020-02-18 |