Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643544 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Ju-Ming Huang | 2023-05-09 |
| 11414532 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same | Chih-Wei Liao, Tsung-Hsien Lin, Ju-Ming Huang | 2022-08-16 |
| 11339258 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Tsung-Hsien Lin, Ju-Ming Huang, Chen-Hua Yu | 2022-05-24 |
| 11008456 | Resin composition and uses of the same | Chih-Wei Liao, Chen-Hua Yu | 2021-05-18 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Ju-Ming Huang, Chen-Hua Yu, Chang-Chien Yang, Chih-Wei Liao | 2021-02-16 |
| 10563006 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao | 2020-02-18 |