Issued Patents All Time
Showing 676–700 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971446 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chien-Hsun Chen | 2021-04-06 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2021-04-06 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2021-04-06 |
| 10971417 | 3D stacked-chip package | Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai | 2021-04-06 |
| 10971371 | Multi-chip structure and method of forming same | Der-Chyang Yeh | 2021-04-06 |
| 10964673 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2021-03-30 |
| 10964666 | Chip on package structure and method | Der-Chyang Yeh, Kuo-Chung Yee, Jui-Pin Hung | 2021-03-30 |
| 10964663 | Die bonder and methods of using the same | Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng | 2021-03-30 |
| 10964650 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2021-03-30 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2021-03-30 |
| 10964591 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2021-03-30 |
| 10962711 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2021-03-30 |
| 10957616 | Package structure and method | Jing-Cheng Lin, Szu-Wei Lu | 2021-03-23 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |
| 10950553 | System on integrated chips and methods of forming the same | Chuei-Tang Wang | 2021-03-16 |
| 10950579 | Integrated circuit package and method of forming same | Ming-Fa Chen, Hsien-Wei Chen | 2021-03-16 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2021-03-16 |
| 10950575 | Package structure and method of forming the same | Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2021-03-16 |
| 10950572 | Die bonder and methods of using the same | Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng | 2021-03-16 |
| 10950556 | EMI shielding structure in InFO package | Kai-Chiang Wu, Ching-Feng Yang, Meng-Tse Chen | 2021-03-16 |
| 10950554 | Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same | Kuo-Chung Yee, Chun-Hui Yu | 2021-03-16 |
| 10943873 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Szu-Wei Lu, Yen-Yao Chi | 2021-03-09 |
| 10943867 | Schemes for forming barrier layers for copper in interconnect structures | Hai-Ching Chen, Tien-I Bao | 2021-03-09 |
| 10943798 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2021-03-09 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2021-03-02 |