Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2021-04-06 |
| 10373885 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2019-08-06 |
| 9666520 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2017-05-30 |