Issued Patents All Time
Showing 626–650 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069573 | Wafer level package structure and method of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11066297 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2021-07-20 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chih-Yuan Chang, Chuei-Tang Wang, Jeng-Shien Hsieh | 2021-07-13 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2021-07-13 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2021-07-13 |
| 11062987 | Semiconductor device | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2021-07-13 |
| 11062975 | Package structures | Yu-Chia Lai, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11062915 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-07-13 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 11056464 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2021-07-06 |
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Geng-Ming CHANG | 2021-07-06 |
| 11056436 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Szu-Wei Lu, Jing-Cheng Lin | 2021-07-06 |
| 11056433 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2021-07-06 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2021-06-29 |
| 11049802 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2021-06-29 |
| 11043731 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2021-06-22 |
| 11043481 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Ming-Fa Chen, Wen-Chih Chiou | 2021-06-22 |
| 11038056 | System and method for source/drain contact processing | Cheng-Hung Chang, Chen-Nan Yeh, Yu-Rung Hsu | 2021-06-15 |
| 11037904 | Singulation and bonding methods and structures formed thereby | Tsang-Jiuh Wu, Wen-Chih Chiou | 2021-06-15 |
| 11037819 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2021-06-15 |
| 11031354 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu | 2021-06-08 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2021-06-08 |
| 11031344 | Package having redistribution layer structure with protective layer and method of fabricating the same | Kuo-Chung Yee, Chun-Hui Yu | 2021-06-08 |
| 11031289 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2021-06-08 |
| 11018095 | Semiconductor structure | Kuo-Chung Yee, Jui-Pin Hung | 2021-05-25 |