Issued Patents All Time
Showing 576–600 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11169207 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2021-11-09 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11171076 | Compute-in-memory packages and methods forming the same | Kuo-Chung Yee | 2021-11-09 |
| 11171088 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2021-11-09 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2021-10-26 |
| 11158775 | Semiconductor device and method | Keng-Han Lin, Hung-Jui Kuo, Hui-Jung Tsai | 2021-10-26 |
| 11156772 | Photonic semiconductor device and method | Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2021-10-26 |
| 11152312 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou +1 more | 2021-10-19 |
| 11152323 | Package with UBM and methods of forming | Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2021-10-19 |
| 11152344 | Integrated circuit package and methods of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-10-19 |
| 11145614 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu | 2021-10-12 |
| 11139206 | Semiconductor device with conductive shielding structure | Chuei-Tang Wang | 2021-10-05 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2021-10-05 |
| 11139249 | Semiconductor devices and methods of forming the same | Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2021-10-05 |
| 11139281 | Molded underfilling for package on package devices | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11133258 | Package with bridge die for interconnection and method forming same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11133274 | Fan-out interconnect structure and method for forming same | Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11133236 | Polymer-based-semiconductor structure with cavity | Hung-Yi Kuo, Hao-Yi Tsai | 2021-09-28 |
| 11133282 | COWOS structures and methods forming same | Szu-Wei Lu | 2021-09-28 |
| 11133283 | Integrated fan-out device | Jiun Yi Wu, Chung-Shi Liu | 2021-09-28 |
| 11133387 | FinFETs having dielectric punch-through stoppers | Cheng-Hung Chang, Chen-Nan Yeh | 2021-09-28 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2021-09-14 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +1 more | 2021-09-14 |
| 11121299 | Semiconductor device and method | Tian Hu, Yu-Hsiang Hu, Hung-Jui Kuo | 2021-09-14 |