Issued Patents All Time
Showing 526–550 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296062 | Three-dimension large system integration | Tin-Hao Kuo | 2022-04-05 |
| 11295979 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chih-Hang Tung | 2022-04-05 |
| 11291116 | Integrated circuit structure | Jui-Pin Hung, Kuo-Chung Yee | 2022-03-29 |
| 11289449 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Chuei-Tang Wang, Monsen Liu | 2022-03-29 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2022-03-29 |
| 11289410 | Integrated circuit packages and methods of forming same | Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2022-03-29 |
| 11282816 | Memory packages and methods of forming same | Chung-Hao Tsai, Chuei-Tang Wang, Yih Wang | 2022-03-22 |
| 11282793 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Szu-Wei Lu, Jing-Cheng Lin | 2022-03-22 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 11282784 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Sung-Feng Yeh | 2022-03-22 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chung-Shi Liu, Yu-Min Liang | 2022-03-22 |
| 11264363 | Chip package structure with seal ring structure | An-Jhih Su, Jing-Cheng Lin, Po-Hao Tsai | 2022-03-01 |
| 11264342 | Package on package structure and method for forming the same | Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11257767 | Interconnect crack arrestor structure and methods | Da-Yuan Shih | 2022-02-22 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2022-02-15 |
| 11251099 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chung-Shi Liu | 2022-02-15 |
| 11251071 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2022-02-08 |
| 11244939 | Package structure and method of forming the same | Chung-Hao Tsai, Chuei-Tang Wang, Wei-Ting Chen | 2022-02-08 |
| 11244924 | Tri-layer CoWoS structure | Shang-Yun Hou, Yun-Han Lee | 2022-02-08 |
| 11239201 | 3D integrated circuit (3DIC) structure | Wen-Chih Chiou, Chung-Shi Liu | 2022-02-01 |
| 11239193 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu | 2022-02-01 |
| 11239157 | Package structure and package-on-package structure | Chuei-Tang Wang, Chung-Hao Tsai, Wei-Ting Chen | 2022-02-01 |
| 11227837 | Integrated circuit package and method | Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |
| 11222883 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2022-01-11 |