Issued Patents All Time
Showing 551–575 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11215929 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Ming-Tan Lee | 2022-01-04 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chung-Shi Liu | 2022-01-04 |
| 11217546 | Embedded voltage regulator structure and method forming same | Jiun Yi Wu, Chien-Hsun Chen | 2022-01-04 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Ching-Feng Yang, Ming-Kai Liu +5 more | 2021-12-28 |
| 11211346 | Semiconductor device and method of manufacture | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai | 2021-12-28 |
| 11211360 | Passive device module, semiconductor package including the same, and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2021-12-28 |
| 11211371 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen | 2021-12-28 |
| 11211336 | Integrated fan-out package and method for fabricating the same | Chun-Hui Yu, Kuo-Chung Yee | 2021-12-28 |
| 11205579 | Molding wafer chamber | Jing-Cheng Lin, Chin-Chuan Chang, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng | 2021-12-21 |
| 11201079 | Wafer chuck | Sih-Hao Liao, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2021-12-14 |
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chih-Yuan Chang | 2021-12-07 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2021-12-07 |
| 11195788 | Hybrid dielectric scheme in packages | Chien-Hsun Chen, Jiun Yi Wu | 2021-12-07 |
| 11195816 | Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same | Kuo-Chung Yee | 2021-12-07 |
| 11189603 | Semiconductor packages and methods of forming same | Der-Chyang Yeh, Han-Ping Pu | 2021-11-30 |
| 11189599 | System formed through package-in-package formation | Sung-Feng Yeh, Ming-Fa Chen | 2021-11-30 |
| 11183473 | Integrated circuit structure having dies with connectors of different sizes | Shin-Puu Jeng, Jing-Cheng Lin | 2021-11-23 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +2 more | 2021-11-23 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11183461 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu | 2021-11-23 |
| 11177238 | Semiconductor structure | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2021-11-16 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2021-11-16 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2021-11-16 |
| 11177434 | Chip package | Kuo-Chung Yee | 2021-11-16 |