Issued Patents All Time
Showing 501–525 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355428 | Semiconductor package | Jiun Yi Wu, Chung-Shi Liu | 2022-06-07 |
| 11355418 | Package structure and manufacturing method thereof | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2022-06-07 |
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2022-05-31 |
| 11342309 | Semiconductor packages and methods of forming same | Chih-Hang Tung, Kuo-Chung Yee | 2022-05-24 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-05-24 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2022-05-24 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11339258 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Guan-Syun Tseng, Tsung-Hsien Lin, Ju-Ming Huang | 2022-05-24 |
| 11335658 | Multi-chip package and method of formation | Jing-Cheng Lin, Jui-Pin Hung, Der-Chyang Yeh | 2022-05-17 |
| 11335767 | Package structure and method of fabricating the same | Chuei-Tang Wang, Tzu-Chun Tang, Wei-Ting Chen, Chieh-Yen Chen | 2022-05-17 |
| 11328975 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-05-10 |
| 11322470 | Optical semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang +1 more | 2022-05-03 |
| 11322450 | Chip package and method of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2022-05-03 |
| 11315900 | Bonded semiconductor devices and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2022-04-26 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Sheng-Yu Wu, Yao-Chun Chuang | 2022-04-26 |
| 11315891 | Methods of forming semiconductor packages having a die with an encapsulant | Chung-Hao Tsai, Chia-Chia Lin, Kai-Chiang Wu, Chuei-Tang Wang | 2022-04-26 |
| 11315805 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2022-04-26 |
| RE49045 | Package on package devices and methods of packaging semiconductor dies | Chien-Hsun Lee, Yung Ching Chen | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |
| 11309289 | Integrated circuit package having heat dissipation structure | Ming-Fa Chen, Hsien-Wei Chen | 2022-04-19 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |
| 11306239 | High thermal conductivity prepreg and uses of the same | Chih-Wei Liao | 2022-04-19 |
| 11304290 | Semiconductor structures and methods | Yung-Chi Lin, Wen-Chih Chiou | 2022-04-12 |
| 11302649 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chih-Yuan Chang | 2022-04-12 |