Issued Patents All Time
Showing 451–475 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462495 | Chiplets 3D SoIC system integration and fabrication methods | Kuo-Chung Yee | 2022-10-04 |
| 11460633 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2022-10-04 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2022-09-27 |
| 11456251 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chung-Hao Tsai, Chuei-Tang Wang | 2022-09-27 |
| 11456240 | Semiconductor device and method of manufacture | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-27 |
| 11456226 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2022-09-27 |
| 11454888 | Semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-09-27 |
| 11454773 | Optical transceiver and manufacturing method thereof | Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2022-09-27 |
| 11450628 | Package structure including a solenoid inductor laterally aside a die and method of fabricating the same | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang, Chia-Chia Lin | 2022-09-20 |
| 11444057 | Package structures and methods of forming | Der-Chyang Yeh, Hsien-Wei Chen | 2022-09-13 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11444002 | Package structure | Yu-Chia Lai, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2022-09-13 |
| 11443995 | Integrated circuit package and method | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-13 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang | 2022-09-13 |
| 11437344 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2022-09-06 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2022-08-23 |
| 11424189 | Pad structure design in fan-out package | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2022-08-23 |
| 11424173 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-08-23 |
| 11417638 | Semiconductor structures | Chi-Hui Lai, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-08-16 |
| 11417633 | Integrated circuit package and method | Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2022-08-16 |
| 11417610 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2022-08-16 |
| 11417606 | Package structure and method of fabricating the same | Shih-Ting Lin, Chi-Hsi Wu, Szu-Wei Lu | 2022-08-16 |
| 11417604 | Dense redistribution layers in semiconductor packages and methods of forming the same | Hung-Jui Kuo, Hui-Jung Tsai | 2022-08-16 |
| 11417580 | Package structures and methods of forming the same | Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-08-16 |