Issued Patents All Time
Showing 401–425 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557546 | Semiconductor structure | Kuo-Chung Yee, Jui-Pin Hung | 2023-01-17 |
| 11545392 | Semiconductor component having through-silicon vias | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2023-01-03 |
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-27 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2022-12-27 |
| 11532868 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang | 2022-12-20 |
| 11532582 | Semiconductor device package and method of manufacture | Jiun Yi Wu | 2022-12-20 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |
| 11532596 | Package structure and method of forming the same | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu | 2022-12-20 |
| 11532540 | Planarizing RDLS in RDL-first processes through CMP process | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-12-20 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Ching-Hua Hsieh, Hsin-Hung Liao, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11532533 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Fong-Yuan Chang, Chieh-Yen Chen | 2022-12-20 |
| 11532565 | System on integrated chips and methods of forming the same | Chuei-Tang Wang | 2022-12-20 |
| 11532425 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |
| 11532567 | Electric magnetic shielding structure in packages | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2022-12-20 |
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2022-12-13 |
| 11527454 | Package structures and methods of forming the same | Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-12-13 |
| 11527419 | Photonic integrated package and method forming same | An-Jhih Su, Wei-Yu Chen | 2022-12-13 |
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2022-12-13 |
| 11527466 | Semiconductor device having via sidewall adhesion with encapsulant | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2022-12-13 |
| 11527486 | Semiconductor device with shield for electromagnetic interference | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen | 2022-12-13 |
| 11521959 | Die stacking structure and method forming same | Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Yi-Li Hsiao | 2022-11-29 |
| 11515272 | Semiconductor die contact structure and method | Chung-Shi Liu | 2022-11-29 |
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Kai-Chiang Wu | 2022-11-29 |