Issued Patents All Time
Showing 376–400 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11625940 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2023-04-11 |
| 11621244 | Integrated circuit package and method | Chuei-Tang Wang, Chieh-Yen Chen, Wei Ling Chang | 2023-04-04 |
| 11616026 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-03-28 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2023-03-28 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11610866 | Semiconductor device and manufacturing method thereof | Wen-Chih Chiou | 2023-03-21 |
| 11610858 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2023-03-21 |
| 11605622 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2023-03-14 |
| 11605621 | Hybrid integrated circuit package and method | Jiun Yi Wu, Hsing-Kuo Hsia | 2023-03-14 |
| 11602056 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-03-07 |
| 11600574 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai | 2023-03-07 |
| 11600431 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2023-03-07 |
| 11592618 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou | 2023-02-28 |
| 11594571 | Stacked image sensor device and method of forming same | Wen-Chih Chiou | 2023-02-28 |
| 11594520 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11594498 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2023-02-28 |
| 11587916 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Tzu-Chun Tang | 2023-02-21 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-02-21 |
| 11587818 | Chuck design and method for wafer | Ming-Tan Lee, Hung-Jui Kuo | 2023-02-21 |
| 11581281 | Packaged semiconductor device and method of forming thereof | Kuo-Chung Yee, Chih-Hang Tung | 2023-02-14 |
| 11574853 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-02-07 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2023-01-31 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2023-01-31 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chih-Yuan Chang | 2023-01-24 |