Issued Patents All Time
Showing 351–375 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-30 |
| 11664350 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu | 2023-05-30 |
| 11664349 | Stacked chip package and methods of manufacture thereof | Ming-Fa Chen, Sung-Feng Yeh | 2023-05-30 |
| 11664322 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2023-05-30 |
| 11658392 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2023-05-23 |
| 11658164 | Electronics card including multi-chip module | Chien-Hsun Lee, Jiun Yi Wu | 2023-05-23 |
| 11658150 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2023-05-23 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11658097 | Manufacturing method for semiconductor device including through die hole | Kuo-Chung Yee | 2023-05-23 |
| 11652086 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii | 2023-05-16 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11651994 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2023-05-16 |
| 11646293 | Semiconductor structure and method | Chia-Shen Cheng, Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Ching-Hua Hsieh | 2023-05-09 |
| 11646281 | Semiconductor structures | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2023-05-09 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +3 more | 2023-05-09 |
| 11646220 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11637097 | Method of manufacturing package structure | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2023-04-25 |
| 11637084 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Kuo-Chung Yee | 2023-04-25 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2023-04-25 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2023-04-18 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11631611 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2023-04-18 |
| 11626296 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |