Issued Patents All Time
Showing 301–325 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776886 | Symmetrical substrate for semiconductor packaging | Jiun Yi Wu | 2023-10-03 |
| 11774675 | Semiconductor device and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-10-03 |
| 11769731 | Architecture for computing system package | Chieh-Yen Chen, Chuei-Tang Wang, Chung-Hao Tsai | 2023-09-26 |
| 11769718 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2023-09-26 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11764171 | Integrated circuit structure and method | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai | 2023-09-19 |
| 11764139 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2023-09-19 |
| 11756945 | Semiconductor device package and methods of manufacture | Jiun Yi Wu | 2023-09-12 |
| 11756852 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-09-12 |
| 11756801 | Stencil structure and method of fabricating package | Jiun Yi Wu | 2023-09-12 |
| 11756731 | Programmable inductor | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2023-09-05 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2023-09-05 |
| 11747563 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou | 2023-09-05 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-08-29 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng | 2023-08-29 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11741737 | Fingerprint sensor in info structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chih Huang | 2023-08-29 |
| 11735576 | Integrated circuit package and method | Chung-Hao Tsai, Chuei-Tang Wang | 2023-08-22 |
| 11728327 | Integrated circuit package and method | Chung-Hao Tsai, Chuei-Tang Wang | 2023-08-15 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11728217 | Wafer level package structure and method of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2023-08-15 |
| 11728181 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-15 |