Issued Patents All Time
Showing 251–275 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855063 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2023-12-26 |
| 11854992 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu | 2023-12-26 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11854998 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2023-12-26 |
| 11854936 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-12-26 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11854988 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2023-12-26 |
| 11855014 | Semiconductor device and method | Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11852868 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2023-12-26 |
| 11854785 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2023-12-26 |
| 11854877 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2023-12-26 |
| 11855016 | Semiconductor device and method of manufacture | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-19 |
| 11848304 | Semiconductor device and method of forming the same | Jiun Yi Wu, Shang-Yun Hou | 2023-12-19 |
| 11848234 | Semiconductor package and method comprising formation of redistribution structure and interconnecting die | Jiun Yi Wu | 2023-12-19 |
| 11848235 | System, device and methods of manufacture | Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu | 2023-12-19 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2023-12-19 |
| 11848288 | Semiconductor device and method | Tzu-Sung Huang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2023-12-19 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2023-12-12 |
| 11842983 | Semiconductor structure | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11841618 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Ming-Tan Lee | 2023-12-12 |
| 11841541 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2023-12-12 |
| 11837567 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2023-12-05 |