Issued Patents All Time
Showing 276–300 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837517 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2023-12-05 |
| 11837550 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2023-12-05 |
| 11837567 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2023-12-05 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11830864 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2023-11-28 |
| 11830844 | Semiconductor structure | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-11-28 |
| 11830861 | Semiconductor package | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2023-11-28 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang +1 more | 2023-11-28 |
| 11830797 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-11-28 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2023-11-21 |
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11817380 | Semiconductor package and method of forming same | Jiun Yi Wu, Chung-Shi Liu | 2023-11-14 |
| 11817361 | Passivation structure with planar top surfaces | Yi-Hsiu Chen, Wen-Chih Chiou | 2023-11-14 |
| 11817325 | Methods of manufacturing a semiconductor package | Jiun Yi Wu | 2023-11-14 |
| 11810899 | 3DIC formation with dies bonded to formed RDLs | Sung-Feng Yeh, Ming-Fa Chen | 2023-11-07 |
| 11810831 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2023-11-07 |
| 11804475 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11804457 | Package structure and manufacturing method thereof | Kuo-Chung Yee | 2023-10-31 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2023-10-24 |
| 11796735 | Integrated 3DIC with stacked photonic dies and method forming same | Hsing-Kuo Hsia | 2023-10-24 |
| 11791275 | Semiconductor device and method of manufacturing | Jiun Yi Wu | 2023-10-17 |
| 11784172 | Deep partition power delivery with deep trench capacitor | Chung-Hao Tsai, Chuei-Tang Wang, Chieh-Yen Chen | 2023-10-10 |
| 11784140 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-10-10 |
| 11776935 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2023-10-03 |