Issued Patents All Time
Showing 226–250 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2024-03-05 |
| 11923207 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-05 |
| 11916028 | Package structure and method of forming the same | Chun-Hui Yu, Kuo-Chung Yee | 2024-02-27 |
| 11908795 | Package structures and method of forming the same | An-Jhih Su | 2024-02-20 |
| 11908706 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2024-02-20 |
| 11901196 | Method for forming photonic integrated package | An-Jhih Su, Wei-Yu Chen | 2024-02-13 |
| 11901302 | InFO-POP structures with TIVs having cavities | Jing-Cheng Lin, Po-Hao Tsai | 2024-02-13 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2024-02-13 |
| 11894318 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-02-06 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11894309 | System on integrated chips (SoIC) and semiconductor structures with integrated SoIC | Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2024-02-06 |
| 11869869 | Heterogeneous dielectric bonding scheme | Wen-Chih Chiou, Ku-Feng Yang, Ming-Tsu Chung | 2024-01-09 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-01-09 |
| 11862606 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2024-01-02 |
| 11862605 | Integrated circuit package and method of forming same | Ming-Fa Chen, Hsien-Wei Chen | 2024-01-02 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-12-26 |
| 11855063 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2023-12-26 |
| 11855029 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2023-12-26 |
| 11855067 | Integrated circuit package and method | Yung-Chi Lin, Wen-Chih Chiou | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11855020 | Chiplets 3D SoIC system integration and fabrication methods | Kuo-Chung Yee | 2023-12-26 |
| 11855046 | Memory packages and methods of forming same | Chung-Hao Tsai, Chuei-Tang Wang, Yih Wang | 2023-12-26 |
| 11855246 | Semiconductor device and method | Keng-Han Lin, Hung-Jui Kuo, Hui-Jung Tsai | 2023-12-26 |
| 11854877 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2023-12-26 |