Issued Patents All Time
Showing 176–200 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12038599 | Photonic package and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Jiun Yi Wu, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12033976 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Kuo-Chung Yee | 2024-07-09 |
| 12033963 | Package structure comprising thermally conductive layer around the IC die | Chung-Hao Tsai, Tzu-Chun Tang, Chuei-Tang Wang | 2024-07-09 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Yi-Li Hsiao | 2024-07-02 |
| 12021053 | Semiconductor package and method | Jiun Yi Wu | 2024-06-25 |
| 12021047 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | Chung-Hao Tsai, Chia-Chia Lin, Kai-Chiang Wu, Chuei-Tang Wang | 2024-06-25 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu | 2024-06-25 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2024-06-25 |
| 12020983 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2024-06-25 |
| 12020953 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 12015008 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-06-18 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Kuo-Chung Yee, Chun-Hui Yu | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12009575 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2024-06-11 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2024-06-11 |
| 12002799 | Die stacking structure and method forming same | Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2024-05-28 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou | 2024-05-28 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2024-05-28 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11984405 | Pad structure design in fan-out package | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2024-05-14 |
| 11984374 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chung-Shi Liu | 2024-05-14 |
| 11978691 | Semiconductor device and manufacturing method thereof | Kuo-Chung Yee | 2024-05-07 |