Issued Patents All Time
Showing 151–175 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Kai-Chiang Wu | 2024-09-03 |
| 12074143 | Integrated circuit package and method | Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12074140 | System formed through package-in-package formation | Sung-Feng Yeh, Ming-Fa Chen | 2024-08-27 |
| 12074127 | Semiconductor die contact structure and method | Chung-Shi Liu | 2024-08-27 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-08-27 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-08-27 |
| 12068297 | Hybrid integrated circuit package | Jiun Yi Wu, Hsing-Kuo Hsia | 2024-08-20 |
| 12068295 | Deep partition power delivery with deep trench capacitor | Chung-Hao Tsai, Chuei-Tang Wang, Chieh-Yen Chen | 2024-08-20 |
| 12062640 | Semiconductor device and manufacturing method thereof | Wen-Chih Chiou | 2024-08-13 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2024-08-13 |
| 12058101 | Package structure and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2024-08-06 |
| 12057438 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-08-06 |
| 12057410 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-08-06 |
| 12057407 | Semiconductor package and method | Jeng-Shien Hsieh, Chuei-Tang Wang, Chieh-Yen Chen | 2024-08-06 |
| 12057406 | Package having redistribution layer structure with protective layer | Kuo-Chung Yee, Chun-Hui Yu | 2024-08-06 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2024-08-06 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2024-08-06 |
| 12051649 | Architecture for computing system package | Chieh-Yen Chen, Chuei-Tang Wang, Chung-Hao Tsai | 2024-07-30 |
| 12051616 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2024-07-30 |
| 12051652 | Package structure and method of fabricating the same | Shih-Ting Lin, Chi-Hsi Wu, Szu-Wei Lu | 2024-07-30 |
| 12051650 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2024-07-30 |
| 12044892 | Package structure including photonic package and interposer having waveguide | Hsing-Kuo Hsia | 2024-07-23 |
| 12040566 | Antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee | 2024-07-16 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |