Issued Patents All Time
Showing 126–150 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-12-03 |
| 12147159 | Semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-11-19 |
| 12148651 | Chuck design and method for wafer | Ming-Tan Lee, Hung-Jui Kuo | 2024-11-19 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2024-11-12 |
| 12142524 | Via for component electrode connection | Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12135454 | Structure and process for photonic packages | Hsing-Kuo Hsia, Kuo-Chiang Ting | 2024-11-05 |
| 12136593 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2024-11-05 |
| 12136612 | Three-dimension large system integration | Tin-Hao Kuo | 2024-11-05 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12125798 | Semiconductor package and method | Jeng-Shien Hsieh, Chuei-Tang Wang, Chieh-Yen Chen | 2024-10-22 |
| 12125812 | Integrated circuit packages and methods of forming the same | Chien-Yuan Huang, Shih-Chang Ku, Chuei-Tang Wang | 2024-10-22 |
| 12119292 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-10-15 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2024-10-15 |
| 12113005 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2024-10-08 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12107051 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2024-10-01 |
| 12100672 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-09-24 |
| 12100698 | Semiconductor device and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-24 |
| 12094860 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Tzu-Chun Tang | 2024-09-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12092861 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia | 2024-09-17 |
| 12087757 | Integrated circuit packages | Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-10 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou | 2024-09-10 |
| 12080684 | Die stacks and methods forming same | Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-03 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2024-09-03 |