Issued Patents All Time
Showing 101–125 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12209015 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2025-01-28 |
| 12211801 | Chip package and method of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2025-01-28 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2025-01-28 |
| 12211779 | Semiconductor package having multiple substrates | Jiun Yi Wu | 2025-01-28 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12205879 | Symmetrical substrate for semiconductor packaging | Jiun Yi Wu | 2025-01-21 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12199051 | Integrated circuit structure and method | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai | 2025-01-14 |
| 12199065 | Multi-die package structures including redistribution layers | Kuo-Chung Yee, Tsung-Ding Wang, Chien-Hsun Lee | 2025-01-14 |
| 12199080 | Electronics card including multi-chip module | Chien-Hsun Lee, Jiun Yi Wu | 2025-01-14 |
| 12199024 | Semiconductor device and method of manufacture | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-01-14 |
| 12191279 | Integrated circuit packages and methods of forming the same | Kuo-Chung Yee | 2025-01-07 |
| 12191251 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chien-Hsun Chen | 2025-01-07 |
| 12193168 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2025-01-07 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2025-01-07 |
| 12191270 | Integrated circuit package and method of forming same | Chuei-Tang Wang, Wei Ling Chang, Chieh-Yen Chen | 2025-01-07 |
| 12183700 | Semiconductor device package and method of manufacture | Jiun Yi Wu | 2024-12-31 |
| 12174415 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2024-12-24 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12170267 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu | 2024-12-17 |
| 12165941 | Semiconductor device and method of manufacture | Chien-Hsun Lee, Jiun Yi Wu | 2024-12-10 |
| 12165985 | Semiconductor device and method | Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12159822 | Method of manufacturing a semiconductor package having conductive pillars | Jiun Yi Wu, Chung-Shi Liu | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-12-03 |