Issued Patents All Time
Showing 201–225 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973074 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia | 2024-04-30 |
| 11967563 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2024-04-23 |
| 11967553 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Sung-Feng Yeh | 2024-04-23 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu | 2024-04-16 |
| 11961789 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2024-04-16 |
| 11961811 | Semiconductor structures and method of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2024-04-16 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11955442 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2024-04-09 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung | 2024-04-09 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |
| 11955349 | Anisotropic carrier for high aspect ratio fanout | Chien Ling Hwang | 2024-04-09 |
| 11953740 | Package structure | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11948930 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Szu-Wei Lu | 2024-04-02 |
| 11948926 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen | 2024-04-02 |
| 11948862 | Package structures and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2024-04-02 |
| 11943080 | Method for estimating dense multipath parameters by means of multipolarized broadband extended array responses | Haiming Wang, Bensheng Yang, Peize Zhang, Wei Hong | 2024-03-26 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |
| 11942433 | Integrated circuit package and method | Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11935802 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2024-03-19 |
| 11935761 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2024-03-19 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Yian-Liang Kuo, Kuo-Chung Yee | 2024-03-19 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chun-Hui Yu, Kuo-Chung Yee | 2024-03-12 |
| 11929261 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Szu-Wei Lu | 2024-03-12 |