Issued Patents All Time
Showing 476–500 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410968 | Semiconductor device and method of forming the same | Jiun Yi Wu, Shang-Yun Hou | 2022-08-09 |
| 11410923 | Semiconductor device, integrated fan-out package and method of forming the same | Chung-Hao Tsai, Chuei-Tang Wang, Wei-Ting Chen | 2022-08-09 |
| 11410918 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier | Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2022-08-09 |
| 11404316 | System, device and methods of manufacture | Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu | 2022-08-02 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2022-07-26 |
| 11393805 | 3D semiconductor packages | Chun-Hui Yu, Kuo-Chung Yee, Liang-Ju Yen | 2022-07-19 |
| 11393770 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2022-07-19 |
| 11393701 | Anisotropic carrier for high aspect ratio fanout | Chien Ling Hwang | 2022-07-19 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2022-07-19 |
| 11387222 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen | 2022-07-12 |
| 11387217 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2022-07-12 |
| 11387205 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2022-07-12 |
| 11387191 | Integrated circuit package and method | Tzu-Yun Huang, Ming-Che Ho, Hung-Jui Kuo | 2022-07-12 |
| 11387118 | Integrated circuit packages and methods of forming same | Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2022-07-12 |
| 11380655 | Die stacks and methods forming same | Chung-Hao Tsai, Chuei-Tang Wang | 2022-07-05 |
| 11380653 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-07-05 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-07-05 |
| 11380620 | Semiconductor package including cavity-mounted device | Jiun Yi Wu | 2022-07-05 |
| 11380598 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2022-07-05 |
| 11362077 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2022-06-14 |
| 11362013 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2022-06-14 |
| 11358722 | Passenger seat with support structure defining empty space | Philippe Erhel, Jerome Vigeant | 2022-06-14 |
| 11355475 | Singulation and bonding methods and structures formed thereby | Tsang-Jiuh Wu, Wen-Chih Chiou | 2022-06-07 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2022-06-07 |
| 11355463 | Semiconductor package and method | Jiun Yi Wu | 2022-06-07 |