Issued Patents All Time
Showing 801–825 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10748870 | Tri-layer COWOS structure | Shang-Yun Hou, Yun-Han Lee | 2020-08-18 |
| 10748841 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2020-08-18 |
| 10746923 | Photonic semiconductor device and method | Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2020-08-18 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2020-08-04 |
| 10734345 | Packaging through pre-formed metal pins | Chien Ling Hwang, Yeong-Jyh Lin | 2020-08-04 |
| 10734323 | Package structures | Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2020-08-04 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chih-Hang Tung | 2020-08-04 |
| 10727217 | Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together | Ming-Fa Chen | 2020-07-28 |
| 10727201 | Packages formed using RDL-last process | Ming-Fa Chen | 2020-07-28 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2020-07-21 |
| 10714457 | Semiconductor packages and methods of forming same | Chih-Hang Tung, Kuo-Chung Yee | 2020-07-14 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2020-07-14 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-07-14 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2020-07-14 |
| 10707173 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Kuo-Chung Yee | 2020-07-07 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10700025 | Fan-out interconnect structure and method for forming same | Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2020-06-30 |
| 10692817 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chih-Yuan Chang | 2020-06-23 |
| 10685937 | Integrated circuit package having dummy structures and method of forming same | Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |