Issued Patents All Time
Showing 826–850 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685911 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Sung-Feng Yeh | 2020-06-16 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |
| 10679968 | Package with thinned substrate | Chung-Hao Tsai, Chuei-Tang Wang | 2020-06-09 |
| 10679951 | Chip-on-substrate packaging on carrier | Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10679947 | Chip package and manufacturing method thereof | Chuei-Tang Wang | 2020-06-09 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10672738 | Package structures and methods of forming | Der-Chyang Yeh, Hsien-Wei Chen | 2020-06-02 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10672647 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2020-06-02 |
| 10665582 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Ming-Fa Chen, Wen-Chih Chiou | 2020-05-26 |
| 10665560 | Optical semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang +1 more | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2020-05-26 |
| 10665468 | Multi-chip structure and method of forming same | Der-Chyang Yeh | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2020-05-26 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2020-05-19 |
| 10658347 | Semiconductor packages and methods of forming the same | Jing-Cheng Lin, Po-Hao Tsai | 2020-05-19 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10658199 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-05-19 |
| 10651675 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2020-05-12 |
| 10651149 | Packages formed using RDL—last process | Ming-Fa Chen | 2020-05-12 |
| 10651137 | Manufacturing method of a package structure | Kuo-Chung Yee | 2020-05-12 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2020-05-05 |
| 10638616 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-04-28 |
| 10636748 | Package structure | Jing-Cheng Lin, Tsei-Chung Fu | 2020-04-28 |