Issued Patents All Time
Showing 876–900 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |
| 10529675 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-01-07 |
| 10529666 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu | 2020-01-07 |
| 10522491 | Semiconductor device and bump formation process | Yi-Li Hsiao, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2019-12-31 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng | 2019-12-31 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2019-12-31 |
| 10522449 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2019-12-31 |
| 10522481 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2019-12-31 |
| 10515933 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Wen-Chih Chiou | 2019-12-24 |
| 10515940 | Method and structure of three-dimensional chip stacking | Wen-Chih Chiou, Yung-Chi Lin | 2019-12-24 |
| 10515851 | Method for forming semiconductor device structure with conductive shielding structure | Chuei-Tang Wang | 2019-12-24 |
| 10515865 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2019-12-24 |
| 10515829 | Package system for integrated circuits | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2019-12-24 |
| 10515901 | InFO-POP structures with TIVs having cavities | Jing-Cheng Lin, Po-Hao Tsai | 2019-12-24 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2019-12-24 |
| 10515921 | Semiconductor package and method of fabricating semiconductor package | Kuo-Chung Yee, Chun-Hui Yu | 2019-12-24 |
| 10510735 | Packages and methods of forming packages | Der-Chyang Yeh, An-Jhih Su | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510710 | Bump-on-trace interconnect | Chen-Shien Chen | 2019-12-17 |
| 10510717 | Chip on package structure and method | Der-Chyang Yeh, Kuo-Chung Yee, Jui-Pin Hung | 2019-12-17 |
| 10510698 | Semiconductor structure and method of forming | Yu-Hsiang Hu, Hung-Jui Kuo | 2019-12-17 |
| 10510699 | Bond structures and the methods of forming the same | Wen-Chih Chiou, Ming-Fa Chen, Yi-Hsiu Chen | 2019-12-17 |
| 10510701 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2019-12-17 |