Issued Patents All Time
Showing 926–950 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497668 | Integrated fan-out package including voltage regulators and methods forming same | Chih-Yuan Chang, Chuei-Tang Wang, Jeng-Shien Hsieh | 2019-12-03 |
| 10490540 | Multi-stack package-on-package structures | An-Jhih Su | 2019-11-26 |
| 10481351 | Semicondcutor packages | Chuei-Tang Wang, Jeng-Shien Hsieh, Hsing-Kuo Hsia | 2019-11-19 |
| 10483187 | Heat spreading device and method | Wensen Hung, Ming-Fa Chen, Tsung-Yu Chen | 2019-11-19 |
| 10483617 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-11-19 |
| 10475764 | Die bonder and methods of using the same | Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng | 2019-11-12 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-11-12 |
| 10475759 | Integrated circuit structure having dies with connectors of different sizes | Shin-Puu Jeng, Jing-Cheng Lin | 2019-11-12 |
| 10475747 | Integrated fan-out package and method for fabricating the same | Chun-Hui Yu, Kuo-Chung Yee | 2019-11-12 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2019-11-12 |
| 10468355 | EMI Shielding structure in InFO package | Kai-Chiang Wu, Ching-Feng Yang, Meng-Tse Chen | 2019-11-05 |
| 10468377 | Device package including molding compound having non-planar top surface around a die | Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2019-11-05 |
| 10468385 | Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung | 2019-11-05 |
| 10461036 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10461034 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Kuo-Chung Yee | 2019-10-29 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2019-10-29 |
| 10460987 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chih-Hang Tung | 2019-10-29 |
| 10453815 | Methods and apparatus for solder connections | Hao-Yi Tsai, Chien-Hsiun Lee, Chung-Shi Liu, Hsien-Wei Chen | 2019-10-22 |
| 10431738 | Integrated fan-out package and method for fabricating the same | Kuo-Chung Yee | 2019-10-01 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu +2 more | 2019-08-13 |
| 10381298 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2019-08-13 |
| 10373885 | 3D stacked-chip package | Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai | 2019-08-06 |
| 10371893 | Hybrid interconnect device and method | Chuei-Tang Wang, Hsing-Kuo Hsia, Yu-Kuang Liao, Chih-Chieh Chang | 2019-08-06 |
| 10366953 | Redistribution layer structures for integrated circuit package | Jie Chen, Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen | 2019-07-30 |
| 10368442 | Integrated circuit structure and method of forming | Jui-Pin Hung, Kuo-Chung Yee | 2019-07-30 |