Issued Patents All Time
Showing 951–975 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361122 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2019-07-23 |
| 10361161 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2019-07-23 |
| 10354983 | Integrated circuit package and methods of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2019-07-16 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2019-07-16 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2019-07-16 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chih Huang | 2019-07-16 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2019-07-09 |
| 10347607 | Semiconductor devices and methods of manufacture thereof | Ching-Pin Yuan, Ming-Fa Chen | 2019-07-09 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2019-07-09 |
| 10340249 | Semiconductor device and method | Kuo-Chung Yee, Chun-Hui Yu | 2019-07-02 |
| 10340236 | Semiconductor device and method of manufacture | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai | 2019-07-02 |
| 10340226 | Interconnect crack arrestor structure and methods | Da-Yuan Shih | 2019-07-02 |
| 10340206 | Dense redistribution layers in semiconductor packages and methods of forming the same | Hung-Jui Kuo, Hui-Jung Tsai | 2019-07-02 |
| 10333623 | Optical transceiver | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2019-06-25 |
| 10332841 | System on integrated chips and methods of forming the same | Chuei-Tang Wang | 2019-06-25 |
| 10332838 | Schemes for forming barrier layers for copper in interconnect structures | Hai-Ching Chen, Tien-I Bao | 2019-06-25 |
| 10325879 | Fan-out stacked system in package (SIP) and the methods of making the same | Kuo-Chung Yee | 2019-06-18 |
| 10325853 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2019-06-18 |
| 10319701 | Bonded 3D integrated circuit (3DIC) structure | Wen-Chih Chiou, Chung-Shi Liu | 2019-06-11 |
| 10319699 | Chip package having die structures of different heights | Wen-Hsin Wei, Chi-Hsi Wu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2019-06-11 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Wen-Shiang Liao, Chewn-Pu Jou, Chih-Hang Tung | 2019-06-11 |
| 10319683 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-06-11 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu | 2019-06-11 |
| 10312327 | FinFETs having dielectric punch-through stoppers | Cheng-Hung Chang, Chen-Nan Yeh | 2019-06-04 |