Issued Patents All Time
Showing 1,001–1,025 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2019-04-23 |
| 10269738 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2019-04-23 |
| 10269741 | Bond structures and the methods of forming the same | Wen-Chih Chiou, Ming-Fa Chen, Yi-Hsiu Chen | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269757 | Integrated circuit with a thermally conductive underfill and methods of forming same | Tien-I Bao | 2019-04-23 |
| 10269762 | Rework process and tool design for semiconductor package | Shih-Ting Lin, Justin Huang, Tsung-Fu Tsai, Jing-Cheng Lin | 2019-04-23 |
| 10269773 | Semiconductor packages and methods of forming the same | Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2019-04-23 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10269616 | Method of fabricating semiconductor device isolation structure | Chen-Nan Yeh, Chu-Yun Fu, Ding-Yuan Chen | 2019-04-23 |
| 10267990 | Hybrid interconnect device and method | Chuei-Tang Wang, Hsing-Kuo Hsia, Yu-Kuang Liao, Chih-Chieh Chang | 2019-04-23 |
| 10268868 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2019-04-23 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2019-04-23 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10269489 | Programmable inductor | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269619 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2019-04-23 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |
| 10269674 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2019-04-23 |
| 10269702 | Info coil structure and methods of manufacturing same | Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2019-04-23 |
| 10269717 | Structure and formation method for chip package | Wen-Chih Chiou | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng | 2019-04-23 |
| 10269728 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chih-Yuan Chang | 2019-04-23 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Tung-Liang Shao, Yi-Li Hsiao, Hsiao-Yun Chen, Chih-Hang Tung | 2019-03-12 |
| 10224293 | Package structure and method for forming the same | Jing-Cheng Lin, Tsei-Chung Fu | 2019-03-05 |
| 10186462 | Semiconductor device and method | Hui-Jung Tsai, Yun Chen Hsieh, Hung-Jui Kou | 2019-01-22 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Albert Wan, Yu-Sheng Hsieh, Chao-Wen Shih, Shou-Zen Chang, Chung-Shi Liu | 2019-01-22 |