Issued Patents All Time
Showing 1,051–1,075 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163857 | Multi-chip fan out package and methods of forming the same | Jing-Cheng Lin, Jui-Pin Hung | 2018-12-25 |
| 10163859 | Structure and formation method for chip package | Ming-Fa Chen, Sung-Feng Yeh | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10163872 | Semiconductor packages and methods of forming the same | Jing-Cheng Lin, Po-Hao Tsai | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10157899 | Packages and methods of forming packages | Der-Chyang Yeh, An-Jhih Su | 2018-12-18 |
| 10157893 | Package-on-package (PoP) structure including stud bulbs | Mirng-Ji Lii, Chung-Shi Liu, Ming-Da Cheng | 2018-12-18 |
| 10157890 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2018-12-18 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Tsung-Fu Tsai, Po-Hao Tsai, Shih-Ting Lin, Szu-Wei Lu +2 more | 2018-12-18 |
| 10157884 | 3D die stacking structure with fine pitches | Chen-Shien Chen, Yen-Chang Hu | 2018-12-18 |
| 10157882 | 3D chip-on-wafer-on-substrate structure with via last process | Ming-Fa Chen, Wen-Ching Tsai, Sung-Feng Yeh | 2018-12-18 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo +2 more | 2018-12-18 |
| 10157867 | Interconnect structure and method | Ying-Ju Chen, Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu | 2018-12-18 |
| 10157864 | Package structure and method of forming the same | Chun-Hui Yu, Kuo-Chung Yee | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2018-12-18 |
| 10157849 | Packages with molding structures and methods of forming the same | Chih-Fan Huang, Cheng-Tar Wu, Ming-Da Cheng, Chung-Shi Liu | 2018-12-18 |
| 10157835 | Package structures and method of forming the same | An-Jhih Su | 2018-12-18 |
| 10157834 | Electronic apparatus | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2018-12-18 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai +1 more | 2018-12-18 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-12-18 |
| 10153239 | Antennas and waveguides in InFO structures | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin | 2018-12-11 |
| 10153222 | Package structures and methods of forming the same | Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Der-Chyang Yeh, Chiung-Han Yeh | 2018-12-11 |
| 10153179 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Shih-Ting Lin | 2018-12-11 |