Issued Patents All Time
Showing 1,076–1,100 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147704 | Semiconductor devices and methods of manufacturing thereof | Ching-Pin Yuan, Ming-Fa Chen | 2018-12-04 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai +2 more | 2018-12-04 |
| 10141291 | Semiconductor device and method of manufacturing the same | Tung-Liang Shao, Chih-Hang Tung | 2018-11-27 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-11-27 |
| 10141253 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2018-11-27 |
| 10141201 | Integrated circuit packages and methods of forming same | Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2018-11-27 |
| 10134945 | Wafer to wafer bonding techniques for III-V wafers and CMOS wafers | Ming Chyi Liu, Chia-Shiung Tsai, Alexander Kalnitsky, Ru-Liang Lee, Eugene Chen | 2018-11-20 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10134708 | Package with thinned substrate | Chung-Hao Tsai, Chuei-Tang Wang | 2018-11-20 |
| 10128213 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2018-11-13 |
| 10121749 | Method of fabricating a post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2018-11-06 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2018-10-30 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2018-10-30 |
| 10109613 | 3DIC stacking device and method of manufacture | Jing-Cheng Lin | 2018-10-23 |
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2018-10-23 |
| 10103125 | Chip package structure and method for forming the same | Jing-Cheng Lin, Po-Hao Tsai, An-Jhih Su | 2018-10-16 |
| 10097030 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2018-10-09 |
| 10096571 | Chip-on-wafer package and method of forming same | Ming-Fa Chen, Sung-Feng Yeh | 2018-10-09 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Yung Ching Chen, Chien-Hsun Lee, Mirng-Ji Lii | 2018-10-02 |
| 10090243 | Inductor for semiconductor integrated circuit | Hao-Hsiang Chuang, Jeng-Shien Hsieh, Chuei-Tang Wang | 2018-10-02 |
| 10090213 | Interposer test structures and methods | Tzuan-Horng Liu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 10083940 | Package-on-package semiconductor device | Der-Chyang Yeh | 2018-09-25 |
| 10074472 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2018-09-11 |
| 10074629 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2018-09-11 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Shin-Puu Jeng, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2018-09-11 |