Issued Patents All Time
Showing 1,126–1,150 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020211 | Wafer-level molding chase design | Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng, Meng-Tse Chen +2 more | 2018-07-10 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan | 2018-07-10 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chien-Hsun Lee, Jiun Yi Wu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 10014271 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2018-07-03 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2018-06-12 |
| 9997497 | Through silicon via structure | Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai | 2018-06-12 |
| 9997467 | Semiconductor packages and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2018-06-12 |
| 9991224 | Bump-on-trace interconnect having varying widths and methods of forming same | Chen-Shien Chen | 2018-06-05 |
| 9985336 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang | 2018-05-29 |
| 9984999 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Dean Wang, Mirng-Ji Lii | 2018-05-29 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9984981 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou +1 more | 2018-05-29 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Shih-Peng Tai | 2018-05-29 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung +1 more | 2018-05-22 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2018-05-15 |
| 9969614 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2018-05-15 |
| 9966360 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2018-05-08 |
| 9966336 | Hybrid interconnect scheme and methods for forming the same | Tien-I Bao | 2018-05-08 |
| 9960088 | End point detection in grinding | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin, Shin-Puu Jeng | 2018-05-01 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2018-05-01 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2018-04-24 |
| 9953892 | Polymer based-semiconductor structure with cavity | Hung-Yi Kuo, Hao-Yi Tsai | 2018-04-24 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Shin-Puu Jeng, Jui-Pin Hung, Hsien-Wen Liu | 2018-04-24 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu, Shih-Wei Liang, Chang-Pin Huang +2 more | 2018-04-17 |
| 9935197 | Semiconductor devices with low junction capacitances | Cheng-Hung Chang, Yu-Rung Hsu | 2018-04-03 |