Issued Patents All Time
Showing 1,151–1,175 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9935090 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2018-04-03 |
| 9929126 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2018-03-27 |
| 9929118 | Packaging through pre-formed metal pins | Chien Ling Hwang, Yeong-Jyh Lin | 2018-03-27 |
| 9929112 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |
| 9922943 | Chip-on-substrate packaging on carrier | Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9917072 | Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2018-03-13 |
| 9911724 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9905520 | Solder ball protection structure with thick polymer layer | Lawrence Chiang Sheu, Hao-Yi Tsai, Chien-Hsiun Lee | 2018-02-27 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-02-27 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2018-02-20 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Hung-Jui Kuo, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo +1 more | 2018-02-20 |
| 9899355 | Three-dimensional integrated circuit structure | Ching-Pin Yuan, Ming-Fa Chen, Sung-Feng Yeh | 2018-02-20 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Yi-Li Hsiao, Tung-Liang Shao, Chih-Hang Tung | 2018-02-13 |
| 9893042 | Semiconductor device and method | Chih-Yuan Chang, Chuei-Tang Wang, Jeng-Shien Hsieh | 2018-02-13 |
| 9893028 | Bond structures and the methods of forming the same | Wen-Chih Chiou, Ming-Fa Chen, Yi-Hsiu Chen | 2018-02-13 |
| 9887162 | Molding structure for wafer level package | Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-02-06 |
| 9881850 | Package structures and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2018-01-30 |
| 9881871 | Schemes for forming barrier layers for copper in interconnect structures | Hai-Ching Chen, Tien-I Bao | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2018-01-23 |
| 9875982 | Semiconductor device and manufacturing method thereof | Ming-Fa Chen, Ching-Pin Yuan, Sung-Feng Yeh | 2018-01-23 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-01-16 |