Issued Patents All Time
Showing 851–875 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2020-04-28 |
| 10629541 | Semiconductor structure and manufacturing method thereof | Kuo-Chung Yee, Jui-Pin Hung | 2020-04-21 |
| 10629540 | Semiconductor device and method | Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2020-04-21 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622701 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang | 2020-04-14 |
| 10622327 | Method for manufacturing semiconductor structure | Ming-Fa Chen, Sung-Feng Yeh | 2020-04-14 |
| 10622321 | Semiconductor structures and methods of forming the same | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2020-04-14 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10622297 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2020-04-14 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2020-02-18 |
| 10559546 | Package on package structure and method for forming the same | Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-02-04 |
| 10553569 | Multi-die structure and method for forming same | Po-Hao Tsai, Jing-Cheng Lin, Li-Hui Cheng | 2020-02-04 |
| 10541228 | Packages formed using RDL-last process | Ming-Fa Chen | 2020-01-21 |
| 10541227 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2020-01-21 |
| 10541226 | Package structure and method of forming the same | Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2020-01-21 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2020-01-14 |
| 10535639 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2020-01-14 |
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Ming-Fa Chen, Wen-Ching Tsai, Sung-Feng Yeh | 2020-01-14 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10529637 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2020-01-07 |
| 10530175 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-01-07 |
| 10529698 | Semiconductor packages and methods of forming same | Der-Chyang Yeh, Han-Ping Pu | 2020-01-07 |