Issued Patents All Time
Showing 776–800 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10811389 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10804247 | Chip package structure with conductive shielding film | An-Jhih Su, Jing-Cheng Lin, Po-Hao Tsai | 2020-10-13 |
| 10804242 | Methods of forming multi-die package structures including redistribution layers | Kuo-Chung Yee, Tsung-Ding Wang, Chien-Hsun Lee | 2020-10-13 |
| 10804178 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2020-10-13 |
| 10797038 | Semiconductor package and rework process for the same | An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu, Der-Chyang Yeh +1 more | 2020-10-06 |
| 10797031 | Semiconductor package | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2020-10-06 |
| 10796990 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chung-Hao Tsai, Chuei-Tang Wang | 2020-10-06 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10790269 | Semiconductor devices and semiconductor structures | Chi-Hui Lai, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2020-09-29 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10790244 | Semiconductor device and method | Tzu-Sung Huang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2020-09-29 |
| 10784248 | Multi-stack package-on-package structures | An-Jhih Su | 2020-09-22 |
| 10784207 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
| 10777518 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2020-09-15 |
| 10777502 | Semiconductor chip, package structure, and pacakge-on-package structure | Chuei-Tang Wang, Chung-Hao Tsai, Wei-Ting Chen | 2020-09-15 |
| 10777430 | Photonic integrated package and method forming same | An-Jhih Su, Wei-Yu Chen | 2020-09-15 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-09-08 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee | 2020-09-08 |
| 10770655 | CHIP package | Kuo-Chung Yee | 2020-09-08 |
| 10770428 | Semiconductor device and method | Chun-Hui Yu, Kuo-Chung Yee | 2020-09-08 |
| 10770365 | Package structures and methods of forming the same | Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10763229 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2020-09-01 |
| 10763164 | Package structure with inductor and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chih-Yuan Chang | 2020-09-01 |