Issued Patents 2023
Showing 76–100 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11741737 | Fingerprint sensor in info structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chih Huang | 2023-08-29 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng | 2023-08-29 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-08-29 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11735576 | Integrated circuit package and method | Chung-Hao Tsai, Chuei-Tang Wang | 2023-08-22 |
| 11728327 | Integrated circuit package and method | Chung-Hao Tsai, Chuei-Tang Wang | 2023-08-15 |
| 11727714 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2023-08-15 |
| 11728181 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-15 |
| 11728217 | Wafer level package structure and method of forming same | Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2023-08-15 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou | 2023-08-08 |
| 11721635 | Chip package and method of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-08 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11715686 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chien-Hsun Chen | 2023-08-01 |
| 11715728 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia | 2023-08-01 |
| 11715727 | Packages and methods of forming packages | Der-Chyang Yeh, An-Jhih Su | 2023-08-01 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2023-07-18 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2023-07-11 |
| 11699694 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Ming-Fa Chen, Wen-Chih Chiou | 2023-07-11 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2023-07-04 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2023-06-27 |
| 11688685 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chewn-Pu Jou, Feng-Wei Kuo | 2023-06-27 |
| 11688639 | Semiconductor device and method | Hung-Pin Chang, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2023-06-27 |
| 11685648 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2023-06-27 |