Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715686 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2023-08-01 |
| 11670575 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Jiun Yi Wu, Shou-Yi Wang | 2023-06-06 |
| 11658085 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |